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 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
LED ARRAY
LA140B-1/H-2
DATA SHEET
DOC. NO : REV. DATE : :
QW0905-LA140B-1/H-2 C 13 - Jan - 2005
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA140B-1/H-2 Page 1/4
Package Dimensions
4.0 2.3O 0.5 5.3
6.35 3.17
2.9
1/4
0.5 TYP 2.54TYP
2.5O 0.5
+
-
4.35O 0.5
LH2643-1
2.9 3.1
3.3
4.3
1.5MAX 25.0MIN 0.5 TYP 1.0MIN 2.54TYP +
Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA140B-1/H-2 Page 2/4
Absolute Maximum Ratings at Ta=25 J
Absolute Maximum Ratings Parameter Symbol H Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir Topr Tstg Tsol 15 60 40 10 -40 ~ +85 mA mA mW UNIT
g A J J
-40 ~ +100 Max 260J for 5 sec Max (2mm from body)
Typical Electrical & Optical Characteristics (Ta=25 J
)
PART NO
MATERIAL Emitted
COLOR
Forward Peak Spectral voltage wave halfwidth length f nm @20mA(V) f Pnm
Viewing angle @10mA(mcd) 2c 1/2 (deg)
Luminous intensity
Lens Water Clear 697 90
Min. Max. Min. 1.7 2.6 8.0
Typ. 12 40
LA140B-1/H-2 GaP
Red
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA140B-1/H-2 Page 3/4
Typical Electro-Optical Characteristics Curve
H CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
3.5
1000
Forward Current(mA)
100
Relative Intensity Normalize @20mA
1.0
3.0 2.5 2.0 1.5 1.0 0.5 0.0
10 1.0
0.1 2.0 3.0 4.0 5.0
1.0
10
100
1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Forward Voltage@20mA Normalize @25J
Relative Intensity@20mA Normalize @25J
-40 -20 0 20 40 60 80 100
1.2 1.1 1.0 0.9 0.8
2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
Ambient Temperature( J
)
Ambient Temperature( J
)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 600 700 800 900 1000
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LA140B-1/H-2 Page 4/4
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65JO 5J 2.RH=90%~95% 3.t=240hrsO 2hrs
The purpose of this test is the resistance of the device under tropical for hous.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105JO 5J &-40JO (10min) (10min) 2.total 10 cycles
5J
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260JO 5J 2.Dwell time= 10O 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2
Solderability Test
1.T.Sol=230JO 5J 2.Dwell time=5O 1sec


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